Autodesk Robot Structural Analysis Professional 2023.0.1 x64 Multilanguage
x64 | Languages:Multilanguage | File Size: 1.68 GB
Description Autodesk® Robot™ Structural Analysis Professional software provides structural engineers with advanced building...
Autodesk AutoCAD 2024 x64
x64 | Language:English | File Size: 2.53 GB
Description
Autodesk AutoCAD 2023 design and documentation software, of the world’s leading 2D and 3D CAD tools. It will allo...
Autodesk AutoCAD Electrical 2024 x64
x64 | Language:English | File Size: 4.87 GB
Description
Autodesk Inc., a world leader in 3D design software for entertainment, natural resources, manufacturing, engineer...
CSI ETABS Ultimate 20.3.0 x64
ETABS 20新版发布!
ETABS是由CSI公司开发研制的房屋建筑结构分析与设计软件,ETABS已有近三十年的发展历史,是美国乃至全球公认的高层结构计算程序,在世界范围内广泛应用,是房屋建筑结...
OpenBuildings Designer CONNECT Edition Update 9.2
OpenBuildings Designer CONNECT Edition Update 9.2 | 18.2 Gb
Languages Supported: Čeština, 中文 (Simplified), English, Français, Deutsch, Italiano, Español, Русский
Th...
MicroStation CONNECT Edition Update 17
MicroStation CONNECT Edition Update 17 | 8.0 Gb
The MicroStation development team is pleased to announce the availability of MicroStation CONNECT Edition Update 17 (10.17....
OpenUtilities Substation CONNECT Edition Update 13
OpenUtilities Substation CONNECT Edition Update 13 | 8.4 Gb
Languages Supported: english or 中文
The Bentley OpenUtilities Substation Design Software development team i...
OpenRoads Designer CONNECT Edition 2022 Release 1 with Bonus
OpenRoads Designer CONNECT Edition 2022 Release 1 with Bonus | 9.3 Gb
The OpenBuildings development team is pleased to announce the availability of OpenRoads Designer 2022...
ESI PAM-DIEMAKER 2021.0 x64 for CATIA V5 R28-R30
File size: 443 MB
ESI Group's CATIA V5 PLM based metal forming portfolio provides die designers with a powerful set of engineering solutions which addresses design and manufa...
ESI NOVA 2022.0 x64
File size: 779 MB
ESI NOVA is a product from ESI GROUP designed to simulate and describe the characteristics of acoustic processes in multilayer materials.
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